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5. Process Improvement 5.4. Analysis of DOE data 5.4.7. Examples of DOE's 5.4.7.3. Response surface model example |
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| A CCD
DOE
with two responses
The goal is to obtain a response surface model for each response
The responses are: "Uniformity" and "Stress" The factors are: "Pressure" and "H2/WF6"
The design is a 13 run CCI
design with 3 center point runs
Low values of both responses are better than high
Steps for fitting a response surface model using JMP 4.04 (other software packages generally have similar procedures) |
Data Source
This example uses experimental data published in Czitrom and Spagon, (1997), Statistical Case Studies for Industrial process Improvement. This material is copyrighted by the American Statistical Society and the Society for Industrial and Applied Mathematics, and used with their permission. Specifically, Chapter 15, titled "Elimination of TiN Peeling During Exposure to CVD Tungsten Deposition Process Using Designed Experiments", describes a semiconductor wafer processing experiment (labeled Experiment 2) run in order to fit response surface models to the two responses deposition layer Uniformity and deposition layer Stress as a function of two particular controllable factors of the chemical vapor deposition (CVD) reactor process. These factors were Pressure (measured in torr) and the ratio of the gaseous reactants H2 and WF6 (called H2/WF6). The experiment also included an important third (categorical) response - the presence or absence of titanium nitride (TiN) peeling. That part of the experiment has been omitted in this example, in order to focus on the response surface model aspects. Experiment Description The maximum and minimum values chosen for pressure were 4 torr and 80 torr. The lower and upper H2/WF6 ratios were chosen to be 2 and 10. Since response curvature, especially for Uniformity, was a distinct possibility, an experimental design that allowed estimating a second order (quadratic) model was needed. The experimenters decided to use a central composite inscribed (CCI) design. This design is typically recommended to have 13 runs with 5 center point runs. However, the experimenters, perhaps to conserve a limited supply of wafer resources, chose to include only 3 center point runs. The design is still rotatable, but the uniform precision property has been sacrificed. The table below shows the CCI design and experimental responses, in the order in which they were run (presumably randomized). The last two columns show coded
values of the factors.
Note: "Uniformity" is calculated from four point probe sheet
resistance measurements made at 49 different locations across a wafer.
The value used in the table is the standard deviation of the 49 measurements
divided by their mean, expressed as a percentage. So a smaller value of
"Uniformity" indicates a more uniform layer - hence lower values
are desirable. The "Stress" calculation is based on an optical measurement
of wafer bow, and again lower values are more desirable.
Analysis of DOE Data Using JMP 4.02 The steps for fitting a response surface (second order or quadratic) model using JMP 4.02 software for this example are as follows:
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| The model specification screen
where we input factors and responses and choose the model we want to fit
We start with a full second order model and select a "Stepwise Fit" Set "prob" to 0.10 and direction to "Mixed" and then "Go" The stepwise routine finds the intercept and three other terms (the main effects and the interaction term) to be significant |
Fitting a Model to the
"Uniformity" Response, Simplifying, the Model and Checking Residuals
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| A JMP analysis using the
model selected by "Stepwise"
The model is fit using coded factors, since the factor columns were given the property "coded" R squared is reasonable for fitting "Uniformity" (well known to be
a hard response to model)
Lack of fit test does not have a problem with the model (very small
"Prob > F " would question the model)
Residual plot looks OK
A visual confirmation of the significant model terms using a Normal
plot
The interaction plot shows why an interaction term is needed (parallel
lines would suggest no interaction)
A contour plot for the "Uniformity" response
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| A detailed study of the residuals does not show any reason to question the model |
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| The model specification screen
where we input factors and responses and choose the model - this
time the "Stress" response will be modeled
We input a full second order model and choose "Stepwise Fit" Set "prob" to 0.10 and direction to "mixed" and then "Go" The stepwise routine finds the intercept, main effects and Pressure squared to be significant terms |
Fitting a Model to the "Stress"
Response, Simplifying, the Model and Checking Residuals
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| We next model "Stress" using these
four significant terms
Note: the model is fit to coded values of the factors, since
the factor columns were given the property "coded"
No lack of fit and a very good R squared for this model
Residual plot looks OK
The interaction plot shows why no interaction term was needed (parallel
lines)
A contour plot of "Stress" as a function of the factors Pressure
and H2/WF6
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| A detailed study of the residuals does not show any reason to question the model |
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| JMP has a "Contour Profiler" and
"Prediction Profiler" that visually and interactively show how the responses
vary as a function of the input factors
You can graphically construct a desirability function and let JMP find the factor settings that maximize it - here it suggests that Pressure should be as high as possible and H2/WF6 as low as possible |
Response Surface Contours for
Both Responses
Prediction Profiles and a Desirability Functions Example for Both
Responses
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| Trade-offs are needed when
optimal results for all responses cannot be achieved by the
same settings
In this case "Uniformity" was chosen as more important Confirmation runs validated the model projections |
Summary
The response surface models fit to (coded) "Uniformity" and "Stress" were:
These models and the corresponding profiler plots show that trade-offs have to be made when trying to achieve low values for both "Uniformity" and "Stress", since a high value of "Pressure" is good for "Uniformity", while a low value of "Pressure" is good for "Stress". While low values of H2/WF6 are good for both responses, the situation is further complicated by the fact that the "Peeling" response (not considered in this analysis) was unacceptable for values of H2/WF6 below around 5. The experimenters chose to focus on optimizing "Uniformity" while keeping H2/WF6 at 5. That meant setting "Pressure" at 80 torr. A set of 16 verification runs at the chosen conditions confirmed that all goals, except those for the "Stress" response, were met by this set of process settings. |
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